PROJECTS
87 fab, advanced-packaging, and supplier builds across the U.S. and key global hubs — by region, status, and developer. We track every major project here; and specialize in helping owners and construction management teams recruit the cleanroom, UPW, and controls crews who deliver them.
Use the navigation below to jump directly to the regional section you want. Each section is organized by status and project type.
Five projects whose scale, complexity, and CHIPS Act anchor positioning mark them as defining builds for the 2024–2030 U.S. and global semiconductor construction cycle.
TSMC’s largest single overseas investment in company history. The Phoenix Fab 21 campus comprises three leading-edge logic fabs (N4/N3/N2 nodes) supporting customers including Apple, NVIDIA, AMD, and Qualcomm. Fab 1 began production in Q1 2025; Fab 2 and Fab 3 are in active construction with sequenced 2027–2030 ramps.
Samsung’s largest single U.S. investment. Initial fab supports advanced foundry capacity at sub-5nm nodes. Phase 2 fab announced for the same campus, with combined commitment now exceeding $44B.
Intel’s anchor U.S. CHIPS Act buildout and the centerpiece of the "Silicon Heartland" initiative. Initial two fabs support Intel’s 18A and next-generation logic processes. Master plan supports expansion to eight fabs.
One of the largest single semiconductor investments ever announced. Micron’s Central New York memory megafab campus targets four fabs over 20 years supporting DRAM production. First fab in early construction phase.
One of TI’s largest U.S. capital programs. The Sherman campus comprises four 300mm analog and embedded processor fabs (LFAB1 already operational; LFAB2–4 in phased delivery through 2030).
Organized by region. We track every project below; on select builds we’re actively recruiting senior PM, superintendent, MEP, commissioning, controls (BMS / Niagara), ultra-pure water, gas systems, and cleanroom-experienced roles.
Second of three TSMC Arizona fabs targeting N3 leading-edge logic for U.S.-customer wafer production.
Third TSMC Arizona fab targeting N2 leading-edge logic. Anchors the long-term U.S. advanced node roadmap.
First TSMC Arizona fab in production as of Q1 2025. Initial U.S.-made leading-edge logic for customers including Apple and AMD.
Intel’s newest Arizona fab supporting the 18A process node and next-generation client and server logic.
Intel’s second new Arizona fab on the Ocotillo campus supporting advanced node capacity.
TSMC’s U.S. advanced packaging facility supporting CoWoS and 3D integration for AI accelerator customers.
Cluster of materials, gas, and chemical supplier plants supporting TSMC and Intel Arizona fab operations.
First fab of Intel’s Ohio One mega campus supporting 18A and next-generation logic processes.
Second Ohio One fab sequenced after Fab 1 in the Phase 1 master plan.
Master plan expansion of the Ohio One campus supporting up to eight fabs over the long horizon.
SK Hynix’s U.S. high-bandwidth memory (HBM) advanced packaging facility supporting AI accelerator integration.
Industrial gas and chemicals supplier plant cluster supporting Intel Ohio One fab operations.
Samsung’s flagship U.S. foundry, supporting advanced node logic for U.S. customers.
Second Samsung Taylor fab supporting continued U.S. foundry capacity expansion.
TI’s second 300mm Sherman fab supporting analog and embedded processor production.
Third TI Sherman fab in the master plan, sequenced after LFAB2.
Fourth and final fab of the TI Sherman master plan.
Continued expansion of TI’s Richardson 300mm fab supporting analog production capacity.
Infineon’s U.S. silicon carbide power semiconductor manufacturing site supporting EV and renewable energy power conversion.
X-FAB analog mixed-signal foundry expansion supporting specialty semiconductor production.
Applied Materials’ Austin equipment manufacturing and R&D expansion supporting semiconductor capital equipment production.
