The US construction giant Bechtel has officially begun work on the first phase of Micron’s ambitious $100 billion semiconductor manufacturing facility in Clay, New York. This memory manufacturing plant, located within the White Pine Commerce Park in Onondaga County, will be the first of several fabrication plants planned to transform the site into the largest semiconductor manufacturing complex in the United States.
Micron first broke ground on the site earlier this year, signaling the start of its major investment in domestic semiconductor production. The project’s initial phase, now under Bechtel’s direction, will involve engineering, procurement, and construction (EPC) operations. Bechtel confirmed it has already mobilized its teams at the 1,300-acre site, setting the stage for what is expected to be a highly technical and demanding construction effort.
"This project represents more than the construction of a semiconductor manufacturing campus, it is part of the foundation of America’s industrial future", said Craig Albert, Bechtel president and COO. "Micron is making a generational investment in U.S. manufacturing, and Bechtel is bringing its world-class execution to deliver the foundation of long-term technology leadership and economic growth."
The construction of the facility is poised to generate substantial economic opportunities. Bechtel estimates that approximately 4,500 construction jobs will be created during the development of the site. Once complete, the larger manufacturing complex is expected to contribute up to 50,000 jobs across New York State, marking it as a cornerstone project for the region’s economy.
Building a semiconductor fabrication facility is no ordinary construction effort. According to Bechtel, such projects are among the most technically sophisticated in the world, necessitating extreme precision in areas like cleanroom systems, ultra-high-purity process infrastructure, advanced electrical systems, and vibration-sensitive foundations. The company plans to utilize its integrated EPC delivery model, incorporating digital-enabled construction technologies, modularization strategies, and advanced project controls to ensure the project meets its rigorous demands.
Despite the project’s momentum, the construction timeline has undergone significant adjustments. Initial plans called for the construction of four fabrication plants over 16 years. However, an amendment to the funding agreement between Micron and the CHIPS Program Office - established under the CHIPS Act to accelerate US semiconductor production - has resulted in delays to the start dates of these facilities.
Construction of Fab 1, initially scheduled to begin in late 2025 and conclude by mid-2028, will now commence in the second quarter of 2026 and extend to the third quarter of 2030. Other fabs, including Fab 2, Fab 3, and Fab 4, will also see adjusted timelines, though the overall project remains on track for completion by 2041. Full production across all four fabs is expected by the end of 2045.
With the first phase of construction now underway, Bechtel and Micron are spearheading a project of immense scale and complexity that is set to bolster the United States’ position in the global semiconductor industry. As work progresses, the Clay site is poised to become a crucial hub for memory chip production, reinforcing the nation’s technological infrastructure and economic vitality for decades to come.
