Per-MW pricing, regional variance, and cost drivers for owners scoping hyperscale & AI builds.
Salary benchmarks across the 14 mission-critical disciplines.
PROJECTS
87 fab, advanced-packaging, and supplier builds across the U.S. and key global hubs — by region, status, and developer. We track every major project here; and specialize in helping owners and construction management teams recruit the cleanroom, UPW, and controls crews who deliver them.
Use the navigation below to jump directly to the regional section you want. Each section is organized by status and project type.
Five projects whose scale, complexity, and CHIPS Act anchor positioning mark them as defining builds for the 2024–2030 U.S. and global semiconductor construction cycle.
TSMC’s largest single overseas investment in company history. The Phoenix Fab 21 campus comprises three leading-edge logic fabs (N4/N3/N2 nodes) supporting customers including Apple, NVIDIA, AMD, and Qualcomm. Fab 1 began production in Q1 2025; Fab 2 and Fab 3 are in active construction with sequenced 2027–2030 ramps.
Samsung’s largest single U.S. investment. Initial fab supports advanced foundry capacity at sub-5nm nodes. Phase 2 fab announced for the same campus, with combined commitment now exceeding $44B.
Intel’s anchor U.S. CHIPS Act buildout and the centerpiece of the "Silicon Heartland" initiative. Initial two fabs support Intel’s 18A and next-generation logic processes. Master plan supports expansion to eight fabs.
One of the largest single semiconductor investments ever announced. Micron’s Central New York memory megafab campus targets four fabs over 20 years supporting DRAM production. First fab in early construction phase.
One of TI’s largest U.S. capital programs. The Sherman campus comprises four 300mm analog and embedded processor fabs (LFAB1 already operational; LFAB2–4 in phased delivery through 2030).
Organized by region. We track every project below; on select builds we’re actively recruiting senior PM, superintendent, MEP, commissioning, controls (BMS / Niagara), ultra-pure water, gas systems, and cleanroom-experienced roles.
Second of three TSMC Arizona fabs targeting N3 leading-edge logic for U.S.-customer wafer production.
Third TSMC Arizona fab targeting N2 leading-edge logic. Anchors the long-term U.S. advanced node roadmap.
First TSMC Arizona fab in production as of Q1 2025. Initial U.S.-made leading-edge logic for customers including Apple and AMD.
Intel’s newest Arizona fab supporting the 18A process node and next-generation client and server logic.
Intel’s second new Arizona fab on the Ocotillo campus supporting advanced node capacity.
TSMC’s U.S. advanced packaging facility supporting CoWoS and 3D integration for AI accelerator customers.
Cluster of materials, gas, and chemical supplier plants supporting TSMC and Intel Arizona fab operations.
First fab of Intel’s Ohio One mega campus supporting 18A and next-generation logic processes.
Second Ohio One fab sequenced after Fab 1 in the Phase 1 master plan.
Master plan expansion of the Ohio One campus supporting up to eight fabs over the long horizon.
SK Hynix’s U.S. high-bandwidth memory (HBM) advanced packaging facility supporting AI accelerator integration.
Industrial gas and chemicals supplier plant cluster supporting Intel Ohio One fab operations.
Samsung’s flagship U.S. foundry, supporting advanced node logic for U.S. customers.
Second Samsung Taylor fab supporting continued U.S. foundry capacity expansion.
TI’s second 300mm Sherman fab supporting analog and embedded processor production.
Third TI Sherman fab in the master plan, sequenced after LFAB2.
Fourth and final fab of the TI Sherman master plan.
Continued expansion of TI’s Richardson 300mm fab supporting analog production capacity.
Infineon’s U.S. silicon carbide power semiconductor manufacturing site supporting EV and renewable energy power conversion.
X-FAB analog mixed-signal foundry expansion supporting specialty semiconductor production.
Applied Materials’ Austin equipment manufacturing and R&D expansion supporting semiconductor capital equipment production.
First Micron Central New York memory fab, anchoring the company’s $100B 20-year master plan for the site.
Three additional Clay NY memory fabs in the master plan, sequenced through the 20-year horizon.
Major expansion of the GlobalFoundries Malta Fab 8 supporting specialty mixed-signal and RF semiconductor production.
Announced second GF Malta fab supporting future U.S. specialty foundry capacity.
Wolfspeed’s flagship silicon carbide power semiconductor fab supporting EV and renewable energy power conversion.
Edwards Vacuum’s U.S. semiconductor equipment plant supporting Micron CNY and the broader Northeast fab cluster.
National Semiconductor Technology Center pilot R&D facility expansion anchored at Albany Nanotech, supporting U.S. advanced node research.
Major expansion of Intel’s D1X campus supporting leading-edge process development and high-volume manufacturing.
Micron’s Boise leading-edge DRAM fab expansion supporting U.S. memory production capacity adjacent to the company HQ.
TI’s Lehi 300mm fab expansion supporting analog and embedded processor production.
Lam Research expansion supporting U.S. semiconductor capital equipment production.
Analog Devices’ Hillsboro fab expansion supporting U.S. analog and mixed-signal production.
Pacific Northwest semiconductor supplier cluster supporting Micron and Intel operations.
onsemi’s Idaho silicon carbide power semiconductor expansion.
onsemi’s flagship U.S. silicon carbide power semiconductor fab supporting EV and renewable energy applications.
ASML’s U.S. headquarters expansion supporting EUV lithography service and R&D operations.
Entegris’ advanced semiconductor materials plant supporting U.S. fab supply chain.
Analog Devices’ Norwood headquarters and R&D campus continuing capacity additions.
Skywater specialty foundry expansion supporting domestic defense and aerospace semiconductor production (note: cross-listed Midwest/Northeast).
KLA’s metrology and inspection equipment R&D facility supporting U.S. semiconductor capital equipment innovation.
SUMCO silicon wafer manufacturing capacity expansion supporting U.S. fab supply chain.
Bosch’s U.S. silicon carbide power semiconductor manufacturing site supporting EV and clean energy applications.
Applied Materials’ flagship campus expansion supporting semiconductor capital equipment R&D and manufacturing.
Lam Research Fremont equipment manufacturing expansion supporting global wafer fabrication equipment supply.
NVIDIA’s Santa Clara HQ Voyager building expansion supporting AI/GPU R&D operations.
AMD’s Santa Clara headquarters and R&D expansion supporting CPU/GPU and AI accelerator development.
Intel’s Folsom design and R&D campus expansion supporting product engineering and validation.
Wolfspeed’s silicon carbide substrate materials plant supporting global SiC power semiconductor supply chain.
Silicon carbide substrate materials capacity expansion supporting growing SiC fab demand.
Specialty semiconductor materials production supporting U.S. and global fab supply chain.
JSR photoresist manufacturing expansion supporting advanced lithography materials supply.
Vishay’s discrete semiconductor fab expansion supporting U.S. power device production.
Hemlock polysilicon manufacturing expansion supporting U.S. semiconductor and solar PV supply chain.
Polar Semiconductor’s Minnesota specialty foundry expansion supporting analog and mixed-signal production.
Coherent’s silicon carbide substrate materials capacity expansion in Pennsylvania.
Coherent specialty semiconductor and laser materials manufacturing expansion.
Microchip’s Colorado Springs fab expansion supporting analog and embedded controller production.
NSTC pilot R&D facility supporting advanced semiconductor research adjacent to TSMC and Intel Arizona operations.
TSMC’s European Semiconductor Manufacturing Company joint venture fab supporting automotive and industrial semiconductor demand.
Intel’s announced flagship European mega-fab campus. Currently in extended permitting / strategic review.
Intel’s flagship Israel Fab 38 expansion supporting global advanced node logic production.
Bosch’s Dresden semiconductor manufacturing campus including SiC and silicon production for automotive applications.
Infineon’s Dresden mega-fab expansion supporting power and analog semiconductor production.
Wolfspeed’s European silicon carbide power semiconductor fab in partnership with ZF supporting EV applications.
ST/GlobalFoundries joint venture 300mm fab in Crolles supporting European specialty semiconductor production.
ST’s Catania silicon carbide fully-integrated manufacturing site supporting global SiC supply chain.
NXP’s European R&D and specialty production campus expansion.
ASML’s flagship Veldhoven headquarters and EUV equipment production expansion.
Siltronic 300mm silicon wafer manufacturing capacity supporting global fab supply chain.
X-FAB’s Erfurt specialty foundry expansion supporting analog and mixed-signal European production.
imec’s leading-edge R&D and pilot line expansion supporting global semiconductor research collaboration.
Silex MEMS foundry expansion supporting global sensor and microsystem device production.
TSMC’s flagship Hsinchu campus continued buildout supporting 2nm production and beyond.
TSMC’s Japanese mega-fabs supporting automotive and industrial semiconductor demand in partnership with Japanese OEMs.
Samsung’s flagship Korean Pyeongtaek mega-campus phases 4 and 5 supporting memory and foundry capacity expansion.
Samsung’s announced Yongin mega cluster supporting up to five advanced semiconductor fabs over the long horizon.
SK Hynix’s Yongin memory cluster expansion supporting DRAM and high-bandwidth memory production.
Micron’s Hiroshima fab expansion supporting EUV-enabled DRAM production for global supply.
Micron’s Taichung memory and HBM advanced packaging expansion.
Rapidus’s 2nm gate-all-around logic fab anchoring Japanese government-supported advanced semiconductor manufacturing return.
Kioxia/WD joint venture NAND flash production expansion supporting global storage demand.
VIS/NXP joint venture 12-inch wafer fab in Singapore supporting analog and mixed-signal production.
UMC’s Singapore 22/28nm fab expansion supporting Asian specialty foundry demand.
GlobalFoundries Singapore expansion supporting specialty foundry demand including automotive and IoT.
ASE’s Taiwan advanced packaging expansion supporting global AI accelerator integration capacity.
Resonac semiconductor materials production expansion supporting Japanese and global fab supply chain.
Every project shown is compiled from public filings, CHIPS Act disclosures, company announcements, regulatory disclosures, and our own placement work across the segment.
To appear in the tracker, a project must meet at least three of the following criteria:
The tracker is maintained by iRecruit.co’s research team in coordination with our active placement work across the segment. Verify all data before referencing in formal documents. Project specifics ($ figures, fab counts, GC assignments, timelines) may have evolved — several CHIPS Act-anchored projects are subject to ongoing policy review.
If you’re researching semiconductor construction projects, you’re likely also evaluating the workforce, cleanroom and ultra-pure water expertise, and process-engineering realities that shape execution on fab builds.
iRecruit.co’s specialty recruiting practice for senior semiconductor and high-tech industrial construction roles.
The closest sector parallel: extreme MEP density, controls fluency, BMS integration, and project-cadence discipline.
NICET, NETA, BCxP, CDCPM, PMP and PE — the credential stacks employers screen for on fab builds.
iRecruit.co recruits the project managers, superintendents, MEP coordinators, controls engineers, cleanroom specialists, ultra-pure water / gas systems leads, and commissioning agents who deliver builds like these. 30-minute scoping call gets you a concrete proposal within 48 hours.
